After the filling of the nano silicon carbide, the thermal conductivity of the membrane and some improvement in the film; join the system of pore-forming agent (the peg), the membrane porosity increased, water vapor permeability enhancement film which makes such structure is more suitable for used i

In the film to nm silicon carbide filled film, the thermal performance is improved to a certain extent; join a hole (PEG), membrane porosity increases, and wet-enhanced this makes the film even more suitable for later apply to active warm clothing in the fabric

Joins the nanometer silicon carbide packing after the membrane, the membrane heat conduction performance has certain improvement; After joins system hole medicinal preparation (PEG), the membrane factor of porosity enhancement, the moisture-penetrability will strengthen this to cause this kind of st

After joining the nanometer silicon carbide filled in the film, film thermal conductivity of a certain degree of improvement; joined the pore-(PEG), membrane porosity increase, water vapor permeability enhancing which makes this structure of membrane is more suitable for the future should be used in

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