Wiping with a clean paper to connect the tube surface and the wire core insulation surface. Half lap winding semi-conduction band of the connecting tube. Both ends of the "pencil" at the semiconductor band overlap. And then evacuated the stress of the glue to pull the thin winding stress of pipe and

Wipe clean with a paper-tube surface and wire insulation surface. In the first half to jump around with half-import. With the two ends to the "pencil" in the first half with a lead. No longer will stress evacuation around the drop-down" in stress management and wire insulation junction. Fill a slope

Scratches the connection tube-surface and the line core insulating layer surface clear with the clean paper.Half joining twines half conduction band on the connecting pipe.Causes its and the both sides “the lead writing skill” place in half conduction band joining.Again disperses the stress the rubb

Cleaning paper cleaning wipe the surface of the pipe surface and core insulation layer. Connecting the upper half lap winding belt. So that it ends "pencil" within half a lap. Then glue thin stress evacuation wound at the junction of pipe stress and core insulation. Fill slopes

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