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關注：1
2013-05-23 12:21
求翻譯：the tips of fine-pitch device leads did not sit properly on the copper pads on a PCB prior to solder process leading to a gap after solder是什么意思？ 待解決
 懸賞分：1
- 離問題結束還有
the tips of fine-pitch device leads did not sit properly on the copper pads on a PCB prior to solder process leading to a gap after solder
問題補充： |
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2013-05-23 12:21:38
正在翻譯，請等待...
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2013-05-23 12:23:18
The tips of fine-pitch leads device did not sit properly on the copper pads PCB prior to solder on a process leading to a gap after solder
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2013-05-23 12:24:58
the tips of fine-pitch device leads did not sit properly on the copper pads on a PCB prior to solder process leading to a gap after solder
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2013-05-23 12:26:38
the tips of fine-pitch device leads did not sit properly on the copper pads on a PCB prior to solder process leading to a gap after solder
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2013-05-23 12:28:18
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