Stress evacuated plastic pull thin wrapped around the outer semi-conductive layer of the fracture, fill into the slope. On both ends of each phase, respectively, into the stress management. Lap outer semi-conductive layer of 20mm. Heating fixed

Evacuation will be stress-thin glue around the outer semi-conductive layer, fill in the gaps. At the end of each phase, respectively, in the strain. Bridges, 20 mm semi-conductive layer. heat retention

Disperses the rubber the stress to pull the thin winding in the outside semiconducting coating fracture place, fills in the pitch.In the both sides each on, distinguishes the wrap to enter the stress tube.Outside joining semiconducting coating 20mm.Heats up fixedly

Stress evacuation adhesive tensile fracture of thin wound semiconductive, fill slopes. At both ends of the phases, respectively in stress pipe. Lap outer semiconducting layer of 20mm. Heat fixation

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