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關(guān)注：1
2013-05-23 12:21
求翻譯：ＭＭＸを基板へ挿入しBonding工程を通過させる時の條件です是什么意思？ 待解決
 懸賞分：1
- 離問題結(jié)束還有
ＭＭＸを基板へ挿入しBonding工程を通過させる時の條件です
問題補充： |
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2013-05-23 12:21:38
Conditions at the time of passing the bonding process to the substrate is inserted MMX
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2013-05-23 12:23:18
To insert the board MMX Bonding process to the conditions of time to pass.
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2013-05-23 12:24:58
When MMX is inserted to the baseplate and Bonding process being made to pass, it is condition
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2013-05-23 12:26:38
When you insert the ＭＭＸ to the Board, through the Bonding process condition
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2013-05-23 12:28:18
正在翻譯，請等待...
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