After the wafer was soaked in a solution of polishing, ultraviolet light through a circuit lines with shielding light, made of etched lines after the transistor, copper, in the pull between the transistor thin copper wire, the final test

wafer is polished after the bubble solution, using ultraviolet rays through a circuit grooves, etching grooves of Shield after the transistor, as a result, the copper plating, transistor-thin copper wire and final test

After the wafer is polished soaks in the solution, had the electric circuit trace shield illumination with the ultraviolet ray penetration, after the etching trace makes the transistor, copper-plating, has pulled the thin copper wire in the transistor between, finally tested

Soaked in the solution after the wafer is polished, shielded irradiation with ultraviolet lines through a circuit, made of etched lines after the transistor, copper-plated, and the thin copper wire between transistors, final test