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關注：1
2013-05-23 12:21
求翻譯：Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands是什么意思？ 待解決
 懸賞分：1
- 離問題結束還有
Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands
問題補充： |
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